Handbook of silicon based MEMS materials and technologies (Record no. 2840)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 03005nam a22002657a 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220607140542.0 |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780128177860 |
| 040 ## - | |
| -- | HITLIB |
| -- | rda |
| 050 ## - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7875 MAR |
| 100 ## - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Markku Tilli; Mervi Paulasto-Krückel; Matthias Petzold; Horst Theuss; Teruaki Motooka; Veikko Lindroos; |
| Relator term | Authors |
| 245 ## - TITLE STATEMENT | |
| Title | Handbook of silicon based MEMS materials and technologies |
| Statement of responsibility, etc. | edited by Markku Tilli; Mervi Paulasto-Krückel; Matthias Petzold; Horst Theuss; Teruaki Motooka; Veikko Lindroos; |
| Medium | Book |
| 250 ## - EDITION STATEMENT | |
| Edition statement | 3rd edition |
| 264 ## - PRODUCTION, PUBLICATION, DISTRIBUTION, MANUFACTURE, AND COPYRIGHT NOTICE | |
| Place of production, publication, distribution, manufacture | Amsterdam : |
| Name of producer, publisher, distributor, manufacturer | William Anderew is an imprint of Elsevier, |
| Date of production, publication, distribution, manufacture, or copyright notice | 2015. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | xxxvii, 787 pages : |
| Other physical details | illustrations ; |
| Dimensions | 29 cm. |
| 336 ## - | |
| -- | rdacontent |
| -- | text |
| -- | txt |
| 337 ## - | |
| -- | rdamedia |
| -- | unmediated |
| -- | n |
| 338 ## - | |
| -- | rdacarrier |
| -- | volume |
| -- | nc |
| 490 av - SERIES STATEMENT | |
| Series statement | Micro & nano technologies series |
| 500 ## - GENERAL NOTE | |
| General note | <br/><br/> Includes index.<br/> |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE | |
| Bibliography, etc. note | Includes bibliographical references |
| 505 ## - | |
| -- | Part I 1. Properties of silicon; Fracture toughness 2. Czochralski Growth of Silicon Crystals 3. Properties of Silicon Crystals 4. Silicon Wafers: Preparation and Properties; Modern technologies 5. Epi Wafers: Preparation and Properties 6. Thin Films on Silicon 7. Thick-Film SOI Wafers: Preparation and properties Part II 8. Multiscale Modeling Methods 9. Mechanical Properties of Silicon Microstructures 10. Electrostatic and RF-Properties of MEMS Structures 11. Optical Modeling of MEMS 12. Modeling of Silicon Etching 13. Gas Damping in Vibrating MEMS Structures 14. Recent Progress in Large-scale Electronic State Calculations and Data-driven Sciences Part III 15. MEMS Lithography 16. Deep Reactive Ion Etching; update 17. Wet Etching of Silicon 18. Porous Silicon Based MEMS 19. Surface Micromachining 20. Vapor Phase Etch Processes for Silicon MEMS 21. Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS 22. Microfluidics and BioMEMS in Silicon Part IV 23. Silicon Direct Bonding 24. Anodic Bonding 25. Glass Frit Bonding 26. Metallic Alloy Seal Bonding 27. Emerging Wafer Bonding Technologies 28. Bonding of CMOS Processed Wafers 29. Wafer-Bonding Equipment 30. Encapsulation by Film Deposition 31. Dicing of MEMS Devices 32. 3D Integration of MEMS 33. Own chapter for eWLP 34. Through-Substrate Via Technologies for MEMS 35. Outgassing and Gettering Part V 36. Silicon Wafer and Thin Film Measurements 37. Oxygen and Bulk Microdefects in Silicon 38. Optical Measurement of Static and Dynamic Displacement in MEMS 39. MEMS Residual Stress Characterization: Methodology and Perspective 40. Microscale deformation analysis 41. Strength of Bonded Interfaces 42. Hermeticity Tests 43. MEMS testing and calibration 44. MEMS Reliability Part VI 45. Case Accelerometer 46. Case Gyroscope 47. Case Pressure Sensor 48. Case Microphone 49. Case Micromirror 50. Case Optical MEMs |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Microelectromechanical systems. |
| Form subdivision | Materials |
| 650 ## - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name entry element | Silicon |
| Form subdivision | Electric properties. |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) | |
| Source of classification or shelving scheme | Library of Congress Classification |
| Koha item type | Books |
| Withdrawn status | Lost status | Source of classification or shelving scheme | Damaged status | Not for loan | Home library | Current library | Shelving location | Date acquired | Source of acquisition | Inventory number | Total Checkouts | Full call number | Barcode | Date last seen | Copy number | Price effective from | Koha item type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Library of Congress Classification | Harare Institute of Technology Main Library | Harare Institute of Technology Main Library | General Collection | 30/05/2022 | Donation: Book Aid International | 4020/D | TK7875 HAN | BK002239 | 22/07/2024 | 1 | 07/06/2022 | Books | |||||
| Library of Congress Classification | Harare Institute of Technology Main Library | Harare Institute of Technology Main Library | General Collection | 24/05/2022 | Donation : Book Aid International | 3923/D | TK7875 HAN | BK002498 | 22/07/2024 | 2 | 08/06/2022 | Books |